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[News] NVIDIA’s Rubin Ultra Seen Sticking to Dual-Die Design on Packaging Constraints; TSMC 3nm Demand Intact

What happened

NVIDIA's Rubin Ultra is shifting to a dual-die design due to packaging constraints, while TSMC's 3nm demand remains robust with AI chips projected to occupy 36% of capacity in 2026.

Impact and signal

High impactImpact score: 95/100

Affected components and suppliers

TSMC 3nm NodeAI Accelerators

NVIDIA TSMC Google AWS

shortagecapacity-tightAI-chips

Source and time

Source: TrendForce · 3/31/2026 · View original source

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[News] NVIDIA’s Rubin Ultra Seen Sticking to Dual-Die Design on Packaging Constraints; TSMC 3nm Demand Intact

What happened

Impact and signal

Affected components and suppliers

Source and time

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