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Hanwha Semitech Nears Supply of Hybrid Bonder to SK Hynix
What happened
Hanwha Semitech is nearing qualification of its second-generation hybrid bonder (SHB2 Nano) with SK Hynix, potentially entering advanced packaging lines. The equipment, co-developed and assembled by Prodrive Technologies, achieves ±100nm alignment accuracy comparable to Besi's models. Neutral: This is a long-term R&D milestone with no immediate impact on component supply, pricing, or trader decisions.
Impact and signal
Low impactImpact score: 10/100
Affected components and suppliers
Hybrid Bonding Equipment
Hanwha SemitechSK Hynix
packagingequipmentsupply-chain
Source and time
Source: The Elec · 3/26/2026 · View original source
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