NuAxiSemiconductor trade intelligence
[News] Kioxia Reportedly to End Slim NAND Packages, Final Shipments due March 2027
What happened
Kioxia will discontinue Thin Small Outline Package (TSOP) NAND products, with final orders due by September 15, 2026, and last shipments scheduled for March 15, 2027. This move is part of a broader industry shift away from lower-value MLC NAND to focus on TLC, QLC, and DRAM production. Bullish: The phase-out of a legacy packaging format reduces future supply, tightening the market for compatible legacy systems and potentially supporting prices for remaining inventory.
Impact and signal
High impactImpact score: 85/100
Affected components and suppliers
NAND FlashMLC NAND
eolsupply-reductioncapacity-restructuring
Source and time
Source: TrendForce · 3/18/2026 · View original source
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